1. Suzhou Institute of Metrology, Suzhou, Jiangsu 215126, China
2. National Institute of Metrology, Beijing 100029, China
3. Colloge of Metrology & Measurement Engineering, China Jiliang University, Hangzhou, Zhejiang, 310018, China
Abstract Aiming at the problem that the spatial resolution standard of X-ray coordinate measuring machine cannot be traced, the development and calibration method of the spatial resolution standard of X-ray coordinate measuring machine are studied.Firstly, based on the wire-to-card method, a regularly traceable grid standard is developed by lithography and inductively coupled plasma (ICP) etching.Secondly, the measurement traceability of the standard is realized by scanning electron microscope. The grid period of standard are 4~40μm, and the uniformity is up to 0.1%, which can meet the current metrological X-ray coordinate measuring machine spatial resolution traceability requirements. Finally, the detachable package protection structure is designed and prepared by 3D printing technology, which is convenient for the popularization and use of the standard in the industry. The above method is helpful to improve the calibration work of X-ray coordinate measuring machine and improve the accuracy level at present.
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QI Z C, NI P J, JIANG W, et al. Spatial Resolution Measurement of Industrial CT System Based on Equal Diameter Circumscribed Circle Phantom［J］. Opticls and Precision Engineering, 2021, 29(1): 61-71.
YANG Q G, TAN B Z. Development and Application of High-performacne Cone-beam Industrial X-ray CT System［J］. Optics and Precision Engineering, 2023, 31(6): 804-812.
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ZANINI F, CARMIGNOTO S. Two-spheres Method for Evaluating the Metrological Structural Resolution in Dimensional Computed Tomography［J］. Measurement Science&Technology, 2017, 28(11): 114002.
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LIU Q H, LI J, SHAN L J, et al. High-energy CT System with 10 lp/mm Spatial Resolution［J］. High Power Laser and Particle Beams, 2022, 34(12): 96-97.
HUANG J F, CHEN X Z, WANG H. Research on the Detection Mehod of Key Parameters of Oral and Maxillofacial CBCT［J］. Acta Metrologica Sinica, 2021, 42(03): 375-379.
PI L, SHI Y S, GAO S T, et al. Calibration of X Ray Coordinate Measuring Machine Based on Ball Plate Standard［J］. Acta Metrologica Sinica, 2017, 38(6A): 104-107.
CHEN S W, SHI Y S, ZHANG X Y, et al. A Method of Calibrating Spatial Resolution of Industrial CT［J］. Nanotechnology and Precision Engineering, 2017, 15(6): 494-498.
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EKIELSKI M, JUCHNIEWICZ M, PLUSKA M, et al. Nanometer Scale Patterning of GaN Using Nanoimprint Lithography and Inductively Coupled Plasma Etching［J］. Microelectronic Engineering, 2015, 133(5): 129-133.
XIA C X, SHENG J, YANG J, et al. Study of Deep Reactive Ion Etching (DRIE) of Silicon Structures with Large Thickness［J］. Navigation Positioning and Timing, 2015, 2(3): 96-101.
LIU F F, ZHANG M G, XU G B, et al. Study of Vertical Degree of ICP Silion Deep Etching Groove Wall［J］. Micronanoelectronic Technology, 2015, 52(3): 185-190.
LI Q, PAN R X, ZANG R, et al. Onthe Application of 3D Printed Medical Materials in Tissue Repair and Therapy［J］. Industrial Microbiology, 2023, 53(3): 4-6.
ZHANG X M, HAN W, WANG H W, et al. Research on the Design of Multifunctional Detection Phantom and 3D Printing Production［J］. Radiol Practice, 2023, 38(9): 1189-1194.
2024, Vol. 45 
