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| The Methods and Prospects of Temperature Measurement for Chip Development in Micro-nano Meter Scale |
| WU Feixiang1,2,XING Li2,FENG Xiaojuan2,ZHANG Jintao2,SUN Jian1 |
1. College of Mechanical and Electrical Engineering, China Jiliang University, Hangzhou, Zhejiang 310018, China
2. Division of Thermophysics, National Institute of Metrology, Beijing 100029, China |
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Abstract The current temperature measurement technology is unable to meet the increasing performance demands of chips. Traditional contact temperature measurement methods such as thermocouple have high precision, but slow response rate, it is difficult to achieve wide field thermal imaging. Non-contact methods such as infrared radiation can achieve rapid thermal field measurement, but the accuracy is low and the wavelength is limited. The traditional temperature measurement methods are inadequate for achieving high precision, rapid temperature measurement at micro-nano scales. With the development of quantum precision temperature measurement technology, diamond negatively charged nitrogen-vacancy(NV-) center temperature measurement technology based on solid quantum spin effect is expected to solve the above problems, breaking through the existing micro-nano scale temperature measurement in the development of chip application bottleneck. In view of this, we first review the characteristics and development status of the existing chip temperature measurement technology, and then analyze the characteristics of diamond NV-center temperature measurement, miniaturization and integration technology trends. Finally, the technical advantages and application prospects in the field of chip development are prospected, and the challenges facing its development are put forward.
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Received: 23 April 2024
Published: 26 September 2024
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2024, Vol. 45 
