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| Research on Fabrication of Flexible Superconducting Circuits |
| ZHU Chengfeng1,LI Wan2,CHEN Jian3,SUN Xiaoying4,ZENG Jiusun1,CAI Jinhui1,WANG Zhenyu1,LI Jinjin3,WANG Xueshen3 |
1. College of Metrology and Testing Engineering,China Jiliang University, Hangzhou, Zhejiang 310018, China
2. College of Physics,Sichuan University, Chengdu, Sichuan 610065, China
3. National Institute of Metrology,Beijing 102200,China
4. Jinan Institute of Quantum Technology,Jinan,Shandong 250101, China |
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Abstract The superconducting transition edge sensor (TES) is the key device for the quantum reproduction of the Candela (Cd) unit and single energy X-ray quantum metrology. Transferring the signal from the large-scale TES array to the readout superconducting quantum interference device (SQUID) electronics on the side of the sensor unit relies on the flexible superconducting circuits. Superconducting transmission lines are fabricated on a flexible polyimide substrate for the low thermal conductivity and resistance-free signal transmission. A silicon (Si) wafer is used as a temporary supporting substrate, and a 100nm Cr film as the sacrificial layer to release the polyimide (PI) film is e-beam evaporated on the Si. Polyimide acid is spin-coated on the Cr film and cured to form the PI film. The Nb/Al thin film transmission lines are fabricated onto the PI film by UV exposure, sputtering and lift-off processes. Then the PI film is released from the silicon substrate due to the high tensile stress of the Cr film, and then the Cr film is wet etched to complete the preparation of flexible superconducting circuits. The superconducting transition temperature Tc of the measured 40Nb/Al transmission lines are 8.9.~9.02K, and the residual resistance ratio(rRR,r300K/r10K)are 5.83~6.96. At 8K, the critical current Ic of 38samples is greater than 1mA. At 4.2K, the Ic of all the samples is greater than 1mA, of which 25samples are larger than 10mA. The Tc and Ic satisfy the requirement of the signal transmission of the TES arrays.
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Received: 08 August 2023
Published: 04 July 2024
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2024, Vol. 45 
